跳转到主要内容

特性

  • 120MHz Arm® Cortex®-M4 CPU
  • Optimal for applications that require a high-performance Cortex-M4F core, that does not require on-chip graphic acceleration or Ethernet connectivity
  • Available in a variety of packages
  • Capacitive Touch Sensing Unit (CTSU)
  • High precision data acquisition analog interfaces
  • Enhanced security

描述

S5D3 为 S5 MCU 群组增加了产品层次, 适用于需要高性能 Cortex®-M4F 内核,但是不需要片上图形加速或以太网连接的应用,比同系列其他产品性价比更高。S5D3 采用高效的 40nm 工艺,提供了增强的安全性和广泛的连接性, 并得到 Synergy 软件包 (SSP) 的全面支持。

Synergy Software Package (SSP)

最佳化且紧密集成的适用软件套,具备可扩展最终产品复杂性并简化复杂系统级服务的商用RTOS。

下载 SSP

产品参数

属性
Program Memory (KB) 512
RAM (KB) 256
Carrier Type Tray
Supply Voltage (V) -
I/O Ports 40, 76
Temp. Range (°C) -40 to +85, -40 to +105
Operating Freq (Max) (MHz) 120
Sub-clock (32.768 kHz) No
On-chip Oscillator No
Ethernet (ch) 0
EtherCat (ch) (#) 0
SCI or UART (ch) 0, 7
CAN (ch) 2
CAN-FD (ch) 0
PWM Output (pin#) 0, 3, 4
32-Bit Timer (ch) 0
16-Bit Timer (ch) (#) 0
8-Bit Timer (ch) 0
Standby operable timer No
16-Bit A/D Converter (ch) 0
14-Bit A/D Converter (ch) 0
12-Bit A/D Converter (ch) 0
10-Bit A/D Converter (ch) 0
12-Bit D/A Converter (ch) 2
8-Bit D/A Converter (ch) 0
Capacitive Touch Sensing Unit (ch) 0
Graphics LCD Controller No
Security & Encryption 128-bit Unique ID, TRNG, AES128, AES192, AES256, 3DES, ARC4, RSA, DSA, ECC, SHA-1, SHA-224, SHA-256, MD5, GHASH

封装选项

Pkg. Type Pkg. Dimensions (mm) Lead Count (#) Pitch (mm)
HWQFN 8 x 8 x 0.8 64 0.4
LFQFP 10 x 10 x 1.7 64
LFQFP 14 x 14 x 1.7 100 0.5
TFLGA 7 x 7 x 1.05 100 0.65

应用

  • 物联网智能边缘传感器

当前筛选条件