Lead Count (#) | 8 |
Pkg. Type | TQFN |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 1.0 x 1.2 |
Pb (Lead) Free | Yes |
Moisture Sensitivity Level (MSL) | 1 |
ECCN (US) | |
HTS (US) |
Pkg. Type | TQFN |
Lead Count (#) | 8 |
Pb (Lead) Free | Yes |
Temp. Range | -40 to +105°C |
Country of Assembly | China, Taiwan |
Country of Wafer Fabrication | Taiwan |
# of Programable Delays (#) | 1 |
Additional Features | Supported in Go Configure™ Software Hub |
CNT/DLY (Max) (#) | 4 |
Carrier Type | Tape & Reel |
DFF (Max) (#) | 4 |
GPIOs (#) | 6 |
LUTs (Max) (#) | 10 |
Look-up Table (LUTs) | 10 |
Memory Type | OTP |
Moisture Sensitivity Level (MSL) | 1 |
Nominal VDD | 1.71-5.5 |
Oscillator Type | RC OSC |
Pipe Delay | 8-stage |
Pitch (mm) | 0.4 |
Pkg. Dimensions (mm) | 1.0 x 1.2 |
Qty. per Reel (#) | 3000 |
The SLG46108-E provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the IO pins, and the macrocells of the SLG46108-E. This highly versatile device allows a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.