Lead Count (#) | 20 |
Pkg. Dimensions (mm) | 2.0 x 3.0 |
Pitch (mm) | 0.4 |
Pkg. Type | TQFN |
Moisture Sensitivity Level (MSL) | 1 |
Pb (Lead) Free | Yes |
ECCN (US) | EAR99 |
HTS (US) | 8542.39.90 |
Lead Count (#) | 20 |
Carrier Type | Tape & Reel |
Moisture Sensitivity Level (MSL) | 1 |
Pkg. Dimensions (mm) | 2.0 x 3.0 |
Pb (Lead) Free | Yes |
Temp. Range | -40 to +85°C |
Country of Assembly | China, Taiwan |
Country of Wafer Fabrication | Taiwan |
Price (USD) | 1ku | 0.60812 |
# of Programable Delays (#) | 1 |
ACMP Channels (#) | 4 |
Additional Features | Supported in Go Configure™ Software Hub |
CNT/DLY (Max) (#) | 7 |
DFF (Max) (#) | 15 |
GPIOs (#) | 18 |
Interface | I2C |
LUTs (Max) (#) | 25 |
Longevity | 2031 11月 |
MOQ | 3000 |
Memory Type | OTP |
Nominal VDD | 1.71-5.5 |
Oscillator Type | Conf. OSC, Ring OSC, Crystal OSC |
Pattern Generator | 1 |
Pipe Delay | 16-stage |
Pitch (mm) | 0.4 |
Pkg. Type | TQFN |
Qty. per Reel (#) | 3000 |
Temperature Sensor (ch) (#) | 1 |
The SLG46533V/M provides a small, low-power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one-time programmable (OTP) non-volatile memory (NVM) to configure the interconnect logic, the I/O pins, and the macrocells of the SLG46533V/M. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.