Pkg. Type: | TSSOP |
Pkg. Code: | |
Lead Count (#): | 20 |
Pkg. Dimensions (mm): | 6.4 x 6.5 |
Pitch (mm): | 0.65 |
Moisture Sensitivity Level (MSL) | 1 |
Pb (Lead) Free | Yes |
ECCN (US) | EAR99 |
HTS (US) | 8542.39.0090 |
Lead Count (#) | 20 |
Carrier Type | Tape & Reel |
Moisture Sensitivity Level (MSL) | 1 |
ACMP Channels (#) | 2 |
Pitch (mm) | 0.65 |
Pkg. Dimensions (mm) | 6.4 x 6.5 |
Qty. per Reel (#) | 4000 |
Pb (Lead) Free | Yes |
Temp. Range (°C) | -40 to +85°C |
Country of Assembly | TAIWAN |
Country of Wafer Fabrication | TAIWAN |
Price (USD) | 1.09584 |
# of Programable Delays (#) | 1 |
Additional Features | Supported in Go Configure™ Software Hub |
CNT/DLY (Max) (#) | 8 |
DCMP | - |
DFF (Max) (#) | 17 |
GPIOs (#) | 17 |
Interface | I2C |
LUTs (Max) (#) | 19 |
Longevity | 2033 5月 |
MOQ | 4000 |
Memory Type | MTP |
Nominal VDD | 2.3 - 5.5 |
Oscillator Type | RC OSC, LF OSC, Ring OSC |
Pattern Generator | 1 |
Pipe Delay | 16-stage |
Pkg. Type | TSSOP |
Temperature Sensor (ch) (#) | 1 |
VDD2 (V) | 1.71 - 5.5 |
The SLG46826 programmable mixed-signal matrix IC with in-system programmability provides a small, low-power component for commonly used mixed-signal functions. The user creates the circuit design by programming the multiple-time programmable non-volatile memory (NVM) to configure the interconnect logic, the IOs, and the macrocells of the SLG46826. This highly versatile device allows for a wide variety of mixed-signal functions to be designed within a very small, low-power single integrated circuit.