封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TQFN |
| Pkg. Code: | |
| Lead Count (#): | 14 |
| Pkg. Dimensions (mm): | 2.0 x 2.2 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Pkg. Type | TQFN |
| Lead Count (#) | 14 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| # of Programable Delays (#) | 1 |
| ACMP Channels (#) | 4 |
| Additional Features | Supported in Go Configure™ Software Hub |
| CNT/DLY (Max) (#) | 7 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| DFF (Max) (#) | 8 |
| GPIOs (#) | 11 |
| Interface | I2C |
| LUTs (Max) (#) | 17 |
| Memory Type | OTP |
| Nominal VDD | 1.71 - 5.5 |
| Oscillator Type | Conf. OSC, Ring OSC |
| Pattern Generator | 1 |
| Pipe Delay | 16-stage |
| Pitch (mm) | 0.4 |
| Pkg. Dimensions (mm) | 2.0 x 2.2 |
| Qty. per Reel (#) | 3000 |
| Special Features | ASM (8 states) |
| Temperature Sensor (ch) (#) | 1 |
| VDD2 (V) | 0.95 - 1.98 |
有关 SLG47525 的资源
描述
SLG47525 GreenPAK™ 可编程混合信号矩阵为常用的混合信号功能提供了一个小型、低功耗元件。 用户通过对一次性可编程（OTP） 非易失性存储器 （NVM） 进行编程来配置互连逻辑、IO 引脚和SLG47525的宏单元，从而创建电路设计。 这种高度通用的器件允许在非常细小的低功耗单个集成电路中设计各种混合信号功能。