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Temperature Sensor for DDR5 Memory Modules

封装信息

CAD 模型:View CAD Model
Pkg. Type:WLCSP
Pkg. Code:AHR6
Lead Count (#):6
Pkg. Dimensions (mm):0.8 x 1.3 x 0.5
Pitch (mm):0.5

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

Lead Count (#)6
Carrier TypeReel
Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
Pb Free Categorye1 SnAgCu
Temp. Range (°C)-40 to 85°C
Comm. InterfaceI2C, I3C
FunctionTemperature Sensor
Input Voltage Range (V)1.7 - 1.98
Lead CompliantNo
Length (mm)0.8
MOQ2500
Pitch (mm)0.5
Pkg. Dimensions (mm)0.8 x 1.3 x 0.5
Pkg. TypeWLCSP
Qty. per Carrier (#)0
Qty. per Reel (#)2500
Reel Size (in)7
SDRAM TypeDDR5 RDIMMs, DDR5 LRDIMMs
Supply Voltage (V)1 - 1, 1.8 - 1.8
Tape & ReelYes
Thickness (mm)0.5
Width (mm)1.3
已发布No

描述

The TS5111 DDR5 Temperature Sensor is a new precision temperature sensor targeted at DDR5 RDIMMs, LRDIMMs and some high-end Gaming DIMMs. Due to its high precision, low power and small footprint, the IC is also well suited for any application that requires a temperature sensor, including Solid State Disks (SSD), embedded computing motherboards, portable devices, and communications equipment. The new Temperature Sensor allows these various applications to run at peak efficiency, saving overall power and enhancing reliability and performance with real-time, closed-loop thermal management algorithms.

The TS5111 has programmable warning flags that enable systems to exercise thermal control loop mechanisms such as memory refresh rates, fan seeds, bandwidth throttling and allows for upper and lower temperature limits. With package dimensions of 0.8 x 1.3mm the temperature sensor can be placed in virtually any location where proximity sensing is critical for reliable operation.

The TS5111 supports I²C, SMBUS, as well as the new I3C Basic protocol for data rates up to 12.5 Mbits/sec, and other advanced features like in-band interrupts, parity checking, and packet error checks.