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封装信息

CAD 模型:View CAD Model
Pkg. Type:FCBGA
Pkg. Code:RM1023
Lead Count (#):1023
Pkg. Dimensions (mm):33.0 x 33.0 x 2.0
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)4
ECCN (US)
HTS (US)

产品属性

Lead Count (#)1023
Pb (Lead) FreeNo
Carrier TypeTray
DRAM I/FDDR2-400
Length (mm)33
MOQ48
Moisture Sensitivity Level (MSL)4
PCI Bus133MHz/64-bit PCI-X
Package Area (mm²)1089
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)33.0 x 33.0 x 2.0
Pkg. TypeFCBGA
Power Consumption Max (W)3.7
Price (USD)$254.6225
Processor BusPowerPC 7xx/7448 -200MHz
Qty. per Carrier (#)24
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)2
Width (mm)33
已发布No

描述

The TSI109 is a host bridge for PowerPC processors that supports PCI-X, DDR2-400 SDRAM, Gigabit Ethernet, and Flash. The device contains numerous integrated features that enable customers to reduce system design complexity and system costs. The TSI109 delivers industry-leading performance for customers in the wireless infrastructure, storage networking, network access, printer, military, and industrial automation markets.