封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TFQFP |
| Pkg. Code: | pkg_3319 |
| Lead Count (#): | 80 |
| Pkg. Dimensions (mm): | 10 x 10 x 1.2 |
| Pitch (mm): | 0.5 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | |
| RoHS (UPD70F3210GK(A)-9EU) | 英语日文 |
| Pb (Lead) Free | No |
| ECCN (US) | |
| HTS (US) |
产品属性
| Program Memory (KB) | 128 |
| RAM (KB) | 6 |
| Lead Count (#) | 80 |
| Timer | 8-bit x 5-ch, 16-bit x 2-ch |
| ADC | 10-bit x 8-ch |
| Temp. Range (°C) | -40 to +85 |
| CPU | V850ES |
| DMA | No |
| Ethernet | No |
| Family Name | V850 |
| LVD or PVD | No |
| Lead Compliant | No |
| Length (mm) | 10 |
| MOQ | 1 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | No |
| Pkg. Dimensions (mm) | 10 x 10 x 1.2 |
| Pkg. Type | TFQFP |
| RTC | No |
| Tape & Reel | No |
| Thickness (mm) | 1.2 |
| Width (mm) | 10 |
有关 V850ES/Kx1 的资源
描述
Support for the V850ES/Kx1 Group is limited to customers who have already adopted these products. If adopting new products, please consider other ranges such as the RX210 Group.