封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICE |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 0 |
| Carrier Type | Wafer |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to +85°C |
| Country of Wafer Fabrication | TAIWAN |
| Adj. Analog Gain | 13.2 - 72 |
| Automotive Qual. | No |
| Function | Resistive SSC |
| Input Type | Single-bridge |
| Interface | I2C, SPI |
| MOQ | 17000 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pkg. Type | WAFER |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Qualification Level | Standard |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Resolution (bits) | 16 |
| Sample Rate Max (KHz) | 0.33 |
| Supply Voltage (V) | 1.8 - 3.6 |
| Tape & Reel | No |
| 已发布 | No |
有关 ZSSC3036 的资源
描述
The ZSSC3036 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3036 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) run