DICE (WAFER 0)

文档标题	信息
Package Description Descriptive text for this package.	DIE SALE (PRICE IN GOOD DIE), DIE SALE (PRICE IN GOOD DIE)-UNSAWN
Package Status	Active
Package Type	WAFER
类别	WAFER
Package Code The unique identifier of this package.	DICE
分类	G
Lead Count	0
Pb (Lead) Free	Yes
长度	0mm
Pb Free Category	e3 Sn
宽度	0mm
Thickness Seated height or Package height (Please check the outline drawing)	0mm
Pitch	0mm
Package Carrier	Wafer
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	0.0 x 0.0 x 0.0

文档


类型	文档标题	日期
封装外形图	Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 696 KB	2022年3月1日
封装外形图	Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch PDF 716 KB	2022年3月1日
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