| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEF |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| Lead Count (#) | 0 |
| Carrier Type | Wafer |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to +125°C |
| Country of Wafer Fabrication | GERMANY |
| Adj. Analog Gain | 2 - 8, 8 - 32, 32 - 130 |
| Automotive Qual. | No |
| Function | Capacitive SSC |
| Input Type | Single-capacitor |
| Interface | I2C, SPI, PDM, Two Alarms |
| MOQ | 9464 |
| Pkg. Type | WAFER |
| Qualification Level | Standard |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Resolution (bits) | 14 |
| Sample Rate Max (KHz) | 1 |
| Supply Voltage (V) | 2.3 - 5.5 |
| Tape & Reel | No |
| 已发布 | No |
The ZSSC3123 cLite™ is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a nonvolatile EEPROM. The ZSSC3123 is configurable for capacitive sensors with capacitances up to 260pF and a sensitivity of 125aF/LSB to 1pF/LSB depending on resolution, speed, and range settings. It is compatible with both single capacitive sensors (both terminals must be accessible) and differential capacitive sensors. Measured and corrected sensor values can be output as I²C, SPI, PDM, or alarms. The I²C interface can be used for a simple PC-controlled calibration procedure to program a set of calibration coefficients into an on-chip EEPROM. The calibrated ZSSC3123 and a specific sensor are mated digitally: fast, precise, and without the cost overhead of trimming by external devices or laser.