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特性

  • Maximum target input capacitance: 260pF
  • Sampling rates as fast as 0.7ms at 8-bit, 1.6ms at 10-bit, 5.0ms at 12-bit, 18.5ms at 14-bit
  • Digital compensation of sensor: piece-wise 1st and 2nd order sensor compensation or up to 3rd order single-region sensor compensation
  • Digital compensation of 1st and 2nd order temperature gain and offset drift
  • Internal temperature compensation reference (no external components)
  • Programmable capacitance span and offset
  • Layout customized for die-die bonding with sensor for low-cost, high-density chip-on-board assembly
  • Accuracy as high as ±0.25% full-scale output at -40°C to 125°C, 3V, 5V, Vsupply ±10% (see data sheet section 1.3 for restrictions)

描述

The ZSSC3123 cLite™ is a CMOS integrated circuit for accurate capacitance-to-digital conversion and sensor-specific correction of capacitive sensor signals. Digital compensation of sensor offset, sensitivity and temperature drift is accomplished via an internal digital signal processor running a correction algorithm with calibration coefficients stored in a nonvolatile EEPROM. The ZSSC3123 is configurable for capacitive sensors with capacitances up to 260pF and a sensitivity of 125aF/LSB to 1pF/LSB depending on resolution, speed, and range settings. It is compatible with both single capacitive sensors (both terminals must be accessible) and differential capacitive sensors. Measured and corrected sensor values can be output as I²C, SPI, PDM, or alarms. The I²C interface can be used for a simple PC-controlled calibration procedure to program a set of calibration coefficients into an on-chip EEPROM. The calibrated ZSSC3123 and a specific sensor are mated digitally: fast, precise, and without the cost overhead of trimming by external devices or laser.

产品参数

属性
Function Capacitive SSC
Automotive Qual. No
Supply Voltage (V) 2.3 - 5.5
Input Type Single-capacitor
Interface I2C, SPI, PDM, Two Alarms
Adj. Analog Gain 2 - 8, 8 - 32, 32 - 130
Resolution (bits) 14
Sample Rate Max (KHz) 1
Temp. Range (°C) -40 to 85°C, -40 to 125°C

封装选项

Pkg. Type Pkg. Dimensions (mm) Lead Count (#) Pitch (mm)
TSSOP 5.0 x 4.4 x 1.0 14 0.65
WAFER 0.0 x 0.0 x 0.0

应用方框图

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A brief introduction and overview of IDT's (acquire by Renesas) sensor signal conditioner evaluation kits. Evaluation kits generally consist of three parts: a communication interface board, a device board, and a sensor simulator board - all connected together. A sophisticated software GUI accompanies the kit, enabling an engineer to learn how to use the part rapidly, do quick prototyping, and practice calibrations.

Presented by David Grice, applications engineer at IDT. For more information about IDT's sensor signal conditioner products, visit the Sensor Signal Conditioner page.