封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEF |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 0 |
| Carrier Type | Wafer |
| Moisture Sensitivity Level (MSL) | 1 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Qty. per Reel (#) | 0 |
| Qty. per Carrier (#) | 0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to 125°C |
| Country of Wafer Fabrication | GERMANY |
| Adj. Analog Gain | 3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105 |
| Automotive Qual. | Yes |
| Function | Resistive SSC |
| Input Type | Single-bridge |
| Interface | Ratiometric Voltage, ZACwire™, I2C |
| MOQ | 2800 |
| Pkg. Type | WAFER |
| Qualification Level | Automotive |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Resolution (bits) | 14 |
| Sample Rate Max (KHz) | 0.2 |
| Supply Voltage (V) | 4.5 - 5.5 |
| Tape & Reel | No |
| 已发布 | No |
有关 ZSSC3135 的资源
描述
The ZSSC3135 is a member of the ZSSC313x product family of CMOS integrated circuits designed for automotive and industrial sensor applications. All family members are well suited for highly accurate amplification and sensor-specific correction of resistive bridge sensor signals. An internal 16-bit RISC microcontroller running a correction algorithm compensates sensor offset, sensitivity, temperature drift, and nonlinearity of the connected sensor element. The required calibration coefficients are stored by the single-pass calibration procedure in an on-chip EEPROM. The ZSSC3135 is specially designed for piezoresistive bridge sensor elements. The amplification stage with an analog gain of 105 in combination with the optional temperature compensation using an external temperature sensor fits the requirements of piezoresistive sensor applications perfectly.