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瑞萨电子 (Renesas Electronics Corporation)
Automotive Sensor Signal Conditioner with Dual Analog Output

封装信息

CAD 模型:View CAD Model
Pkg. Type:VFQFPN
Pkg. Code:NLG32
Lead Count (#):32
Pkg. Dimensions (mm):5.0 x 5.0 x 0.9
Pitch (mm):0.5

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

产品属性

Lead Count (#)32
Carrier TypeReel
Moisture Sensitivity Level (MSL)1
Pitch (mm)0.5
Pkg. Dimensions (mm)5.0 x 5.0 x 0.9
Qty. per Reel (#)5000
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Temp. Range (°C)-40 to 125°C
Country of Wafer FabricationGERMANY
Country of AssemblyTHAILAND
Adj. Analog Gain3 - 3, 7 - 7, 9 - 9, 14 - 14, 26 - 26, 35 - 35, 52 - 52, 70 - 70, 105 - 105, 140 - 140, 210 - 210, 280 - 280, 420 - 420
Automotive Qual.Yes
FunctionResistive SSC
Input TypeSingle-bridge
InterfaceRatiometric Voltage, ZACwire™, I2C, Dual Analog Out
Length (mm)5
MOQ5000
Package Area (mm²)25
Pkg. TypeVFQFPN
Qty. per Carrier (#)0
Qualification LevelAutomotive
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Resolution (bits)14
Sample Rate Max (KHz)2
Supply Voltage (V)4.5 - 5.5
Tape & ReelYes
Thickness (mm)0.9
Width (mm)5

描述

The ZSSC3154 is an integrated circuit for highly accurate amplification and sensor-specific correction of a bridge sensor signal. Up to two temperature sensors can also be read in parallel. The circuitry provides different configurations of the analog outputs to show two measurement results simultaneously. This also allows generating a complementary bridge sensor signal, which is often required in safety-relevant applications. The ZSSC3154 can take readings from two external temperature sensors to compensate the temperature drift of the bridge sensor signal and to output a separate temperature signal. An internal calibration microcontroller in addition with an on-chip EEPROM performs the digital compensation of the sensor offset, the sensitivity, the temperature drift, and the nonlinearity. The one-pass digital end-of-line calibration plus the integrated broken chip-detection supports automatic and highly efficient mass production.