The overall structure of the Renesas package code is as follows.
Table 1. Package Structure Codes
| Code | Description | Code | Description |
|---|---|---|---|
| C | Ceramic (laminated ceramic) | G | Ceramic (glass sealed) |
| M | Package consisting of metal | P | Package consisting of plastic |
| S | Package using wafer process | T | Package consisting of tape |
| W | Optical translucent package |
Table 2. Package Installation Height Codes
| Code | Description | Code | Description | Code | Description |
|---|---|---|---|---|---|
| R | 1.70 < R | L | 1.20 < L <= 1.70 | T | 1.00 < T <= 1.20 |
| V | 0.80 < V <= 1.00 | W | 0.65 < W <= 0.80 | U | 0.50 < U <= 0.65 |
| X | X <= 0.50 |
(Unit : mm)
Table 3. Package Appearance Codes
| Code | Appearance | Code | Appearance | Code | Appearance |
|---|---|---|---|---|---|
| BG | BGA | ||||
| CA | Card with connector | CB | No-contact card | CC | Card with surface-contact pin |
| DP | DIP | DT | DTP | ||
| LG | LGA | PG | PGA | ||
| QF | QFF | QJ | QFJ | QN | QFN |
| QP | QFP | QT | QTP | QW | QFI |
| SA | TSOP (1) | SB | TSOP (2) | SF | SOF |
| SJ | SOJ | SN | SON | SP | SOP |
| SS | SIP | SV | SVP | SW | SOI |
| TP | Asymmetric DTP | ||||
| ZP | ZIP | ZZ | Special |
Table 4. Sample Pin Numbers
| Display | No. Pins | Display | No. Pins | Display | No. Pins | Display | No. Pins |
|---|---|---|---|---|---|---|---|
| 0000 | Contact-less | 0008 | 8pin | 0208 | 208pin | 1848 | 1848pin |
The number here does not always match the actual number of pins in case that some pins connected or depopulated.
Table 5. Pin Pitch Codes
| Code | Pin Pitch | Code | Pin Pitch | Code | Pin Pitch | Code | Pin Pitch | Code | Pin Pitch |
|---|---|---|---|---|---|---|---|---|---|
| A | 2.54 | B | 1.778 | C | 1.50 | D | 1.27 | E | 1.25 |
| F | 1.00 | G | 0.80 | H | 0.75 | J | 0.65 | K | 0.50 |
| L | 0.40 | M | 0.30 | Z | Other than the above |
(Unit : mm)
