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瑞萨电子 (Renesas Electronics Corporation)

描述

RYZ012x1 的 PMOD 扩展板为 RYZ012A1/B1 的评估和开发提供一个切入点。 PMOD 扩展板可通过 PMOD 接口轻松连接瑞萨 MCU 套件。 此外,还可以通过 SPI 或 UART 接口控制 PMOD 扩展板。

特性

  • 板载 RYZ012A1
  • 通过 PMOD 轻松连接到瑞萨 MCU
  • 通过引脚选择 UART / SPI 接口
  • 为蓝牙™低功耗 (LE) 操作写入的固件
  • 由 RA MCU 系列的灵活配置软件包 (FSP) 和 QE for BLE 工具支持
  • 适用于 RX MCU 的驱动

应用

  • 智能家居
  • 可穿戴设备和追踪器
  • 农业
  • 普通电话连接
  • 需要具备基本低功耗蓝牙功能及最小化设计及验证投入的入门级大众产品
类型 文档标题 日期
快速入门指南 PDF 199 KB
应用说明 PDF 10.24 MB
AI 生成的摘要: The document explains how to update the RYZ012 Bluetooth LE module firmware via BLE radio OTA using an EK-RA4M2 board as the host MCU. It details hardware and software requirements, including the EK-RA4M2 kit, PMOD Expansion Board, e2 studio IDE, and TelinkBleOTA app. The firmware update process uses Serial Port Profile (SPP) communication between the host MCU and RYZ012 module. It covers assembly instructions, software setup, and troubleshooting tips for a successful OTA firmware update. The document also provides guidance on project import, build, execution, and BLE initialization.
应用说明 PDF 9.01 MB
AI 生成的摘要: The firmware update process enables the host MCU to program the RYZ012 Bluetooth LE module via a Serial Port Profile (SPP) communication interface. Using the EK-RA4M2 board connected to the RYZ012 PMOD Expansion Board, the host MCU transfers and installs firmware updates to adapt to evolving system requirements. The update requires specific hardware, including the EK-RA4M2 kit, RYZ012 PMOD board with firmware v5.4 or later, and a Windows 10 PC. Software tools include e2 studio IDE, Renesas Flexible Software Package, QE for BLE, SEGGER J-Link RTT Viewer, Tera Term, and GATT Browser. Assembly involves connecting the RYZ012 PMOD to the EK-RA4M2 via PMOD connectors and configuring jumpers for USB communication. The document details the update procedure, project setup, software architecture, and troubleshooting tips for reliable firmware programming.
PCB 设计文件
登录后下载 ZIP 1.06 MB
应用说明 PDF 1.81 MB 日本語
AI 生成的摘要: The RYZ012 Bluetooth Low Energy FIT module provides an API-based software solution to control the Renesas RYZ012 BLE module. It integrates with other FIT modules such as SCI for communication, BYTEQ for buffer management, and BSP for board support. The software package includes configuration files, source code for communication processing, interface functions, and hardware abstraction layers. The document details software architecture, file structure, hardware and software requirements, and instructions for adding the FIT module to projects. It also covers BLE interfaces including GAP, GATT, and vendor-specific functions, along with sample code generation using QE for BLE.
应用说明
登录后下载 PDF 2.01 MB
AI 生成的摘要: The RYZ012 Bluetooth Low Energy module integrates with the EK-RA6M3 board or compatible custom boards to enable Bluetooth LE communication using a Serial Port Profile (SPP) command system. Demo projects include GATT Server implementations with and without FreeRTOS, allowing remote control of board LEDs and switch notifications via Bluetooth LE. The software structure supports BareMetal and FreeRTOS environments, featuring API callbacks, GATT database registration, and event handling for GAP, GATTS, and GATTC. The package includes detailed guidance on assembling hardware, importing projects, building, debugging, and customizing Bluetooth LE applications.
应用说明
登录后下载 PDF 1.08 MB 日本語
AI 生成的摘要: This document explains the process to acquire Bluetooth qualification for products using the RYZ012x1 Bluetooth Low Energy module. It details the necessary steps including Bluetooth SIG membership registration, personal account acquisition, Declaration ID purchase, and product registration. The document provides Qualified Design Identification numbers (QDIDs) for reference and outlines RF-PHY testing requirements for different module versions. It also includes a comprehensive package of certification documents, test reports, and compliance folders to support qualification. The guide helps manufacturers navigate Bluetooth licensing and trademark use requirements effectively.
7 项目

软件与工具

软件与工具

Software title
Software type
公司
RA 可扩展性强的配置软件包 (FSP)
FSP 是一款增强型软件包,旨在为使用瑞萨电子 RA 系列 Arm 微控制器的嵌入式系统设计提供简单易用且可扩展性强的高质量软件。
Software Package 瑞萨电子
QE for BLE: Development Assistance Tool for Bluetooth® Low Energy
Debugging support tool that specializes in Bluetooth® Low Energy system development [Plugin for Renesas IDE "e² studio"] [Support MCU/MPU: RA, RX, RL78]
Solution Toolkit 瑞萨电子
快速连接平台
快速连接平台通过提供兼容的硬件和软件构建模块,实现快速原型设计。
Software and Hardware Development Tools 瑞萨电子
3 项目

样例程序

样例程序

筛选
类型 文档标题 日期 日期
示例代码
[Software=FSP],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
登录后下载 ZIP 10.24 MB Compiler: GCC ARM Embedded IDE: e2 studio
示例代码
[Software=FSP | v4.2.0],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
登录后下载 ZIP 10.29 MB IDE: e2 studio IDE v2022-10
示例代码
登录后下载 ZIP 6.26 MB
应用: 工业, 消费电子产品
Compiler: CC-RX Function: Communication Interface, Driver or Library IDE: e2 studio
示例代码
登录后下载 ZIP 2.07 MB
应用: 工业, 消费电子产品
Compiler: GNU ARM Embedded Function: Communication Interface IDE: e2 studio
示例代码
登录后下载 ZIP 3.62 MB
5 项目
器件号状态库存SampleablePb (Lead) Free
RTKYZ012A1B00000BEObsolete有库存N/ANo
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