AE-CAP1 - 电容式触摸应用

AI 生成的摘要: Capacitive touch sensing integration using Renesas Synergy MCUs involves creating a project with e2 studio and Synergy Smart Configurator, adding required modules, and using QE for Capacitive Touch plug-in for interface creation, tuning, and monitoring. The process includes starting measurements with scanStart() API, checking results, and detecting touches via dataGet() API. Development requires S3A7(CTSU) board, e2 studio IDE, GNU ARM compiler, QE for Capacitive Touch, and SSP drivers. The document guides through project creation, module addition, interface setup, tuning, and performance monitoring.

AI 生成的摘要: The document provides programming guidelines for the Renesas Synergy AE-CAP1 out-of-box demonstration. It details minimum PC requirements, AE-CAP1 kit components, and available demonstration programs with their functionalities. It explains installing USB CDC device drivers for Windows 7 and 10, highlighting automatic enumeration on Windows 10 and manual driver installation on Windows 7. Instructions for reloading the AE-CAP1-BWS demonstration on AE-CAP1-S1 and AE-CAP1-BWS boards are included, specifying jumper settings for proper setup.

AI 生成的摘要: The document explains how to create and migrate custom Board Support Packages (BSPs) for Renesas Synergy SSP versions 1.1.z and 1.2.0. It details the use of the Custom BSP Creator and Custom Pack Creator tools to generate, modify, and package BSPs. Custom BSPs mainly require changes in the board folder, including essential files like bsp.h and bsp_init.c. The process involves creating a base BSP, making a template pack for modifications, editing in e2 studio, and finalizing a standard pack for distribution. An example using the DK-S7G2 board illustrates these steps.