| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages. | L23.2.6X3.5 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger. | LUU |
| Package Description Descriptive text for this package. | 23 Lead, 2.6x3.5mm Flip Chip QFN (FCQFN) |
| Package Status | Active |
| Package Type | QFN |
| Package Code The unique identifier of this package. | LUU |
| 分类 | PLASTIC |
| Lead Count | 23 |
| Pb (Lead) Free | Yes |
| 长度 | 3.5mm |
| 宽度 | 2.6mm |
| Thickness Seated height or Package height (Please check the outline drawing) | 0.85mm |
| Pitch | 0.4mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5 | 3.50 x 2.60 x 0.85 |