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pkg_20115 (S-UFBGA 16)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
SUBG0016KB-A
JEITA Standard
The JEITA standard to which the device is compliant.
S-UFBGA16-1.871x2.478-0.50
Package Description
Descriptive text for this package.
Terminal Material - Base: Sn-Ag-Cu
Package Status
Active
Package Type
S-UFBGA
类别
IC
Package Code
The unique identifier of this package.
pkg_20115
Lead Count
16
Pb (Lead) Free
Yes
长度
2.478mm
宽度
1.871mm
Thickness
Seated height or Package height
(Please check the outline drawing)
0.6mm
Pitch
0.5mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
2.478 x 1.871 x 0.6

文档

类型 文档标题 日期
封装外形图 PDF 170 KB
运输/封装 PDF 64 KB 日本語
2 items