pkg_20135 (S-UFBGA 25)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	SUBG0025LB-A
JEITA Standard The JEITA standard to which the device is compliant.	S-UFBGA25-2.14x2.27-0.40
Package Description Descriptive text for this package.	Terminal Material - Base: Sn-Ag-Cu-Ni
Package Status	Active
Package Type	S-UFBGA
类别	IC
Package Code The unique identifier of this package.	pkg_20135
Lead Count	25
Pb (Lead) Free	Yes
长度	2.27mm
宽度	2.14mm
Thickness Seated height or Package height (Please check the outline drawing)	0.55mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.14 x 2.27 x 0.55