| 文档标题 | 信息 |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
S3X3.9 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
SBA |
| Package Description Descriptive text for this package.
|
9 Ball OPTICAL CHIP SCALE PACKAGE (OCSP), 3x3 ARRAY |
| Package Status | Active |
| Package Type | OCSP |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package.
|
SBA |
| 分类 | PLASTIC |
| Lead Count | 9 |
| Pb (Lead) Free | Yes |
| 长度 | 2.15mm |
| 宽度 | 2.15mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
| Pitch | 0.65mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
2.15 x 2.15 x 0.00 |
SBA (OCSP 9)
跳转至页面部分：