| 文档标题 | 信息 |
|---|---|
| Package Description Descriptive text for this package.
|
WLCSP 16L 1 778 x 1.778 (0.4 mm pitch) |
| Package Status | Active |
| Package Type | WLCSP |
| 类别 | PLASTIC |
| Package Code The unique identifier of this package.
|
WC0016AA |
| 分类 | G |
| Lead Count | 64 |
| Pb (Lead) Free | Yes |
| 长度 | 1.78mm |
| Pb Free Category | e1 SnAgCu |
| 宽度 | 1.78mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0.3mm |
| Peak Reflow Temp | 260°C |
| Pitch | 0.4mm |
| Package Carrier | Reel |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
1.78 x 1.78 x 0.3 |
文档
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| 类型 | 文档标题 | 日期 |
| 封装外形图 | PDF 194 KB | |
| 封装外形图 |
Package Outline Drawing Package Code: WC0016AA 16 Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
PDF
197 KB
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2 items
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