WDE (WLCSP-TKCURDLBC 20)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W4X5.20F
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WDE
Package Description Descriptive text for this package.	20 Ball WLCSP, 4x5 ARRAY, 0.4mm Pitch(with BSC)-ASECL
Package Status	Active
Package Type	WLCSP-TKCURDLBC
类别	PLASTIC
Package Code The unique identifier of this package.	WDE
分类	PLASTIC
Lead Count	20
Pb (Lead) Free	Yes
长度	2.34mm
宽度	1.72mm
Thickness Seated height or Package height (Please check the outline drawing)	0.54mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.34 x 1.72 x 0.54

文档


类型	文档标题	日期
封装外形图	W4x5.20F: 20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH) PDF 115 KB	2013年5月3日
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