WEC (WLCSP-BP 16)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W4X4.16
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WEC
Package Description Descriptive text for this package.	16 Ball WLCSP, 4x4 ARRAY, 0.4mm Pitch
Package Status	Active
Package Type	WLCSP-BP
类别	PLASTIC
Package Code The unique identifier of this package.	WEC
分类	PLASTIC
Lead Count	16
Pb (Lead) Free	Yes
长度	1.97mm
宽度	1.81mm
Thickness Seated height or Package height (Please check the outline drawing)	0mm
Pitch	0mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	1.97 x 1.81 x 0.00

文档


类型	文档标题	日期
封装外形图	W4X4.16: 4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP) PDF 117 KB	2006年9月15日
1 item