WFY (WLCSP-BP 35)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W5X7.35
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WFY
Package Description Descriptive text for this package.	35 Ball WLCSP, 5x7 ARRAY, 0.4mm Pitch - ASECL
Package Status	Active
Package Type	WLCSP-BP
类别	PLASTIC
Package Code The unique identifier of this package.	WFY
分类	PLASTIC
Lead Count	35
Pb (Lead) Free	Yes
长度	2.88mm
宽度	2.14mm
Thickness Seated height or Package height (Please check the outline drawing)	0mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.88 x 2.14 x 0.00

文档


类型	文档标题	日期
封装外形图	w5x7.35: 35 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) PDF 152 KB	2014年11月21日
1 item