WPZ (WLCSP-BP 36)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W6X6.36D
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WPZ
Package Description Descriptive text for this package.	6x6 36 balls, 0.4mm Pitch, WLCSP; ASE Chung-Li
Package Status	Active
Package Type	WLCSP-BP
Package Code The unique identifier of this package.	WPZ
分类	PLASTIC
Lead Count	36
Pb (Lead) Free	Yes
长度	2.41mm
宽度	2.41mm
Thickness Seated height or Package height (Please check the outline drawing)	0.5mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.41 x 2.41 x 0.50

文档


类型	文档标题	日期
封装外形图	W6x6.36D: 36 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch) PDF 152 KB	2019年11月1日
1 item