WQM (WLCSP-BP 20)

文档标题	信息
Pkg. Name Name used to describe Renesas packages.	W4X5.20U
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.	WQM
Package Description Descriptive text for this package.	4x5 20 Balls, 0.4mm Pitch, WLCSP; UAT
Package Status	Active
Package Type	WLCSP-BP
Package Code The unique identifier of this package.	WQM
分类	PLASTIC
Lead Count	20
Pb (Lead) Free	Yes
长度	2.07mm
宽度	1.68mm
Thickness Seated height or Package height (Please check the outline drawing)	0.5mm
Pitch	0.4mm
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5	2.07 x 1.68 x 0.50

文档


类型	文档标题	日期
封装外形图	W4x5.20U: 20 Ball Wafer Chip Scale Package (WLCSP 0.4mm Pitch) PDF 148 KB	2021年10月19日
1 item