瑞萨电子 (Renesas Electronics Corporation)
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YGA (Module 23)

文档标题 信息
Pkg. Name
Name used to describe Renesas packages.
 L23.6.5X9
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 YGA
Package Description
Descriptive text for this package.
 23 LEAD QFN 6.5 x 9.0 (1.85mm Nom) (0.5mm Pitch)
Package Status
 Active
Package Type
 Module
Package Code
The unique identifier of this package.
 YGA
分类
 PLASTIC
Lead Count
 23
Pb (Lead) Free
 Yes
长度
 9mm
宽度
 6.5mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 1.85mm
Pitch
 0.5mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 9.00 x 6.50 x 1.85