封装信息
| Pitch (mm) | 1.27 |
| Lead Count (#) | 16 |
| Pkg. Dimensions (mm) | 9.9 x 3.9 x 1.5 |
| Pkg. Code | DCG16 |
| Pkg. Type | SOIC |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 16 |
| Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | 3 |
| Qty. per Carrier (#) | 48 |
| Package Area (mm²) | 38.6 |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 9.9 x 3.9 x 1.5 |
| Qty. per Reel (#) | 0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range | -40 to +85°C |
| Country of Assembly | Philippines, Taiwan |
| Country of Wafer Fabrication | Taiwan, United States |
| Price (USD) | 6.25542 |
| Core Voltage (V) | 3.3 |
| Function | Buffer |
| Input Freq (MHz) | 0 - 133.33 |
| Input Type | LVCMOS |
| Inputs (#) | 1 |
| Length (mm) | 9.9 |
| MOQ | 96 |
| Output Banks (#) | 1 |
| Output Freq Range (MHz) | 0 - 133.33 |
| Output Skew (ps) | 250 |
| Output Type | LVCMOS |
| Output Voltage (V) | 3.3 |
| Outputs (#) | 9 |
| Pkg. Type | SOIC |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Thickness (mm) | 1.5 |
| Width (mm) | 3.9 |
有关 2309NZ-1H 的资源
描述
The IDT2309NZ is a low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems with SDRAM support. This part has nine outputs, eight of which can be used to drive two DIMMs or four SO-DIMMs, and the remaining can be used for external feedback to a PLL. The IDT2309NZ operates at 3.3V and outputs can run up to 133.33MHz The IDT2309NZ is designed for low EMI and power optimization. It has multiple VDD and VSS pins for noise optimization and consumes less than 32mA at 66.6MHz, making it ideal for the low power requirements of mobile systems.