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1K x 9 DualAsync FIFO, 5.0V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TSSOP
Pkg. Code:PAG56
Lead Count (#):56
Pkg. Dimensions (mm):14.0 x 6.1 x 1.0
Pitch (mm):0.5

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)1
ECCN (US)
HTS (US)

产品属性

Lead Count (#)56
Pb (Lead) FreeYes
Carrier TypeReel
Moisture Sensitivity Level (MSL)1
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
Access Time (ns)12
ArchitectureDual FIFO
Bus Width (bits)9
Core Voltage (V)5
Density (Kb)9
Family NameDualAsync
I/O Type5.0 V TTL
InterfaceAsynchronous
Length (mm)14
MOQ2000
Organization1K x 9
Package Area (mm²)85.4
Pb Free Categorye3 Sn
Pitch (mm)0.5
Pkg. Dimensions (mm)14.0 x 6.1 x 1.0
Pkg. TypeTSSOP
Qty. per Carrier (#)0
Qty. per Reel (#)2000
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)0 to 70°C
Thickness (mm)1
Width (mm)6.1
已发布No

描述

The 7282 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.