封装信息
| Pkg. Type: | WAFER |
| Pkg. Code: | DICE |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Pb (Lead) Free | Yes |
| Carrier Type | Wafer |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb Free Category | e3 Sn |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 70°C |
| 已发布 | No |
有关 72T20118 的资源
描述
This product is obsolete.