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64K x 72 TeraSync FIFO, 2.5V

封装信息

CAD 模型:View CAD Model
Pkg. Type:PBGA
Pkg. Code:BBG324
Lead Count (#):324
Pkg. Dimensions (mm):19.0 x 19.0 x 1.76
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Lead Count (#)324
Pb (Lead) FreeYes
Carrier TypeTray
ArchitectureUni-directional
Bus Width (bits)72
Core Voltage (V)2.5
Density (Kb)4096
Family NameTeraSync
FunctionBus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz)200 - 200
I/O Type1.5 V HSTL, 1.8 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
InterfaceSynchronous
Length (mm)19
MOQ20
Moisture Sensitivity Level (MSL)3
Organization64K x 72
Package Area (mm²)361
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)19.0 x 19.0 x 1.76
Pkg. TypePBGA
Price (USD)$273.859
Qty. per Carrier (#)84
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.76
Width (mm)19
已发布No

描述

The 72T72105 is a 64K x 72 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x72/x36/x18 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through (FWFT) mode.