封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | PBGA |
| Pkg. Code: | BBG324 |
| Lead Count (#): | 324 |
| Pkg. Dimensions (mm): | 19.0 x 19.0 x 1.76 |
| Pitch (mm): | 1 |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.32.0071 |
产品属性
| Lead Count (#) | 324 |
| Pb (Lead) Free | Yes |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | PHILIPPINES |
| Country of Wafer Fabrication | TAIWAN, USA |
| Architecture | Uni-directional |
| Bus Width (bits) | 72 |
| Core Voltage (V) | 2.5 |
| Density (Kb) | 9216 |
| Family Name | TeraSync |
| Function | Bus Matching, JTAG, Mark & Retransmit |
| I/O Frequency (MHz) | 225 - 225 |
| I/O Type | 1.5 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL |
| Interface | Synchronous |
| Length (mm) | 19 |
| MOQ | 25 |
| Organization | 128K x 72 |
| Package Area (mm²) | 361 |
| Pb Free Category | e1 SnAgCu |
| Pitch (mm) | 1 |
| Pkg. Dimensions (mm) | 19.0 x 19.0 x 1.76 |
| Pkg. Type | PBGA |
| Price (USD) | $325.6328 |
| Qty. per Carrier (#) | 84 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 70°C |
| Thickness (mm) | 1.76 |
| Width (mm) | 19 |
有关 72T72115 的资源
描述
The 72T72115 is a 128K x 72 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x72/x36/x18 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through (FWFT) mode.
