封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | CABGA |
| Pkg. Code: | BFG96 |
| Lead Count (#): | 96 |
| Pkg. Dimensions (mm): | 13.5 x 5.5 x 1.4 |
| Pitch (mm): | 0.8 |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | CABGA |
| Lead Count (#) | 96 |
| Pb (Lead) Free | Yes |
| Carrier Type | Tray |
| DIMM Type | PC2-3200, PC2-4300 |
| Function | Buffer/Driver |
| JEDEC Raw Card | R/C A, R/C B, R/C C |
| Length (mm) | 13.5 |
| MOQ | 270 |
| Memory Module Type | DDR2 |
| Moisture Sensitivity Level (MSL) | 3 |
| Package Area (mm²) | 74.3 |
| Pb Free Category | e1 SnAgCu |
| Pitch (mm) | 0.8 |
| Pkg. Dimensions (mm) | 13.5 x 5.5 x 1.4 |
| Qty. per Carrier (#) | 270 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 70°C |
| Thickness (mm) | 1.4 |
| Width (mm) | 5.5 |
有关 74SSTU32864G 的资源
描述
Along with CSPUA877A or 98ULPA877A DDR2 PLL Provides a fully JEDEC compliant solution for non parity DDR2 RDIMMs for 400 and 533MHz.