封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | PAG64 |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 17.0 x 6.1 x 1.0 |
| Pitch (mm): | 0.5 |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | TSSOP |
| Lead Count (#) | 64 |
| Pb (Lead) Free | Yes |
| Carrier Type | Reel |
| DIMM Type | PC1600, PC2-2100, PC2-2700, PC2-3200 |
| Function | Buffer/Driver |
| JEDEC Raw Card | R/C B, R/C C, R/C D, R/C E, R/C F, R/C N |
| Length (mm) | 17 |
| MOQ | 2000 |
| Memory Module Type | DDR2 |
| Moisture Sensitivity Level (MSL) | 1 |
| Package Area (mm²) | 103.7 |
| Pb Free Category | e3 Sn |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 17.0 x 6.1 x 1.0 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 2000 |
| Reel Size (in) | 13 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | Yes |
| Temp. Range (°C) | 0 to 70°C |
| Thickness (mm) | 1 |
| Width (mm) | 6.1 |
| 已发布 | No |
有关 74SSTVN16859 的资源
描述
Not recommended for new designs