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瑞萨电子 (Renesas Electronics Corporation)
Low Skew Dual Bank DDR I/II Fan-out Buffer

封装信息

CAD 模型:View CAD Model
Pkg. Type:TSSOP
Pkg. Code:PGG28
Lead Count (#):28
Pkg. Dimensions (mm):9.7 x 4.4 x 1.0
Pitch (mm):0.65

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
ECCN (US)EAR99
HTS (US)8542.39.0090

产品属性

Lead Count (#)28
Carrier TypeTube
Moisture Sensitivity Level (MSL)1
Qty. per Reel (#)0
Qty. per Carrier (#)50
Package Area (mm²)42.7
Pkg. Dimensions (mm)9.7 x 4.4 x 1.0
Pb (Lead) FreeYes
Pb Free Categorye3 Sn
Temp. Range (°C)0 to 70°C
Core Voltage (V)1.8V, 2.5V
FunctionBuffer
Input Freq (MHz)45 - 500
Input TypeLVCMOS
Inputs (#)1
Length (mm)9.7
MOQ2000
Output Banks (#)1
Output Freq Range (MHz)45 - 500
Output Skew (ps)40
Output TypeLVCMOS
Output Voltage (V)1.8V, 2.5V
Outputs (#)6
Pitch (mm)0.65
Pkg. TypeTSSOP
Product CategoryClock Buffers & Drivers
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Thickness (mm)1
Width (mm)4.4

描述

Dual DDR I/II fanout buffer for VIA Chipset