封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | 2x3 DFN |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Sample Catalog | 申请样品 |
| Pkg. Type | 2x3 DFN |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Assembly Location | CHINA |
| Deep Power Down (µA) | 0.7 |
| Interface | Single SPI, Dual SPI, Quad SPI, QPI |
| Key Benefit | Standard features |
| Longevity | 2036 四月 |
| Memory Class | Standard Flash |
| Memory Type | Standard |
| Operating Voltage Range (V) | 1.65 - 1.95 |
| Pb (Lead) Free | Yes |
| Qty. per Reel (#) | 5000 |
| Read Current (mA) | 2 |
| Speed | 133 MHz |
| Supply Voltage Vcc (V) | 1.65 - 1.95 |
| Temp. Range (°C) | -40 to +85°C |
| Vcc (V) | 1.65-1.95 |
有关 AT25SL0161C 的资源
描述
AT25SL0161 是一款 16Mbit 串行外设接口（SPI）闪存，适合用于各种大批量工业、消费类和联网应用场景。 此器件可用于存储程序代码，在系统启动时将这些代码从闪存复制到嵌入式或外部 RAM 中，或通过就地执行（XiP）功能直接从闪存执行程序代码。