封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TEPBGA |
| Pkg. Code: | AER480 |
| Lead Count (#): | 480 |
| Pkg. Dimensions (mm): | 37.5 x 37.5 x 2.33 |
| Pitch (mm): | 1.27 |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | TEPBGA |
| Lead Count (#) | 480 |
| Pb (Lead) Free | Yes |
| Carrier Type | Tray |
| Length (mm) | 37.5 |
| MOQ | 42 |
| Moisture Sensitivity Level (MSL) | 3 |
| PCI Bus | 66MHz/64 bit PCI |
| Package Area (mm²) | 1406.3 |
| Pb Free Category | e1 SnAgCu |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 37.5 x 37.5 x 2.33 |
| Power Consumption Max (W) | 3 |
| Processor Bus | PowerQUICC II (MPC82xx)-100MHz |
| Qty. per Carrier (#) | 21 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Secondary Bus | 66MHz/32-bit PCI |
| Tape & Reel | No |
| Temp. Range (°C) | 0 to 70°C |
| Thickness (mm) | 2.33 |
| Width (mm) | 37.5 |
有关 CA91L8200B 的资源
描述
The CA91L8200B (PowerSpan II Dual) is a multi-port PCI bus switch that bridges PCI to the PowerQUICC II (MPC8260), MPC7xx, PowerPC™ 7xx, and PMC-Sierra WinPath™ processors. The integrated, non-transparent PCI-to-PCI bridge in the dual PCI PowerSpan II allows designers to reduce component count and increase overall system performance.