Pitch (mm) | 2.54 |
Lead Count (#) | 16 |
Pkg. Type | SBDIP |
Pkg. Dimensions (mm) | 20.32 x 7.49 x 2.41 |
Pkg. Code | DAV |
Moisture Sensitivity Level (MSL) | Not Applicable |
Pb (Lead) Free | Exempt |
ECCN (US) | 3A001 |
HTS (US) |
Pkg. Type | SBDIP |
Lead Count (#) | 16 |
Carrier Type | Tube |
Moisture Sensitivity Level (MSL) | Not Applicable |
Pitch (mm) | 2.5 |
Pkg. Dimensions (mm) | 20.3 x 7.5 x 2.41 |
DLA SMD | 5962R9660501VEC |
Pb (Lead) Free | Exempt |
Pb Free Category | Gold Plate over compliant Undercoat-e4 |
MOQ | 25 |
Temp. Range | -55 to +125°C |
DSEE (MeV·cm2/mg) | 75 |
Length (mm) | 20.3 |
Qualification Level | QML Class V (space) |
Rating | Space |
TID HDR (krad(Si)) | 100 |
TID LDR (krad(Si)) | ELDRS free |
Thickness (mm) | 2.41 |
Width (mm) | 7.5 |
The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W.