封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | DIE |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.00 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Yes |
| RoHS (CD4023BHSR) | 英语日文 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | DIE |
| Carrier Type | Die Waffle Pack |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.00 |
| DLA SMD | 5962R9662103V9A |
| Pb (Lead) Free | Yes |
| Pb Free Category | None |
| MOQ | 100 |
| Temp. Range (°C) | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Lead Compliant | No |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Tape & Reel | No |
有关 CD4023BMS 的资源
描述
The CD4023BMS is a triple 3-input CMOS NAND gate that provides the system designer with direct implementation of the NAND function and supplements the existing family of CMOS gates. All inputs and outputs are buffered. The CD4023BMS is supplied in these 14-lead outline packages: Braze Seal DIP H4Q, Frit Seal DIP H1B and a Ceramic Flatpack H3W.