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封装信息

CAD 模型: View CAD Model
Pkg. Type: SBDIP
Pkg. Code: HSG
Lead Count (#): 14
Pkg. Dimensions (mm): 19.00 x 7.37 x 2.41
Pitch (mm): 2.54

环境和出口类别

Moisture Sensitivity Level (MSL) Not Applicable
Pb (Lead) Free Exempt
ECCN (US)
HTS (US)

产品属性

Pkg. Type SBDIP
Lead Count (#) 14
Carrier Type Tube
Moisture Sensitivity Level (MSL) Not Applicable
Pitch (mm) 2.5
Pkg. Dimensions (mm) 19.0 x 7.4 x 2.41
DLA SMD 5962R9582604VCC
Pb (Lead) Free Exempt
Pb Free Category Gold Plate over compliant Undercoat-e4
MOQ 25
Temp. Range (°C) -55 to +125°C
DSEE (MeV·cm2/mg) 75
Length (mm) 19
Qualification Level QML Class V (space)
Rating Space
TID HDR (krad(Si)) 100
TID LDR (krad(Si)) ELDRS free
Thickness (mm) 2.41
Width (mm) 7.4

描述

The CD4000BMS (dual 3 plus inverter), CD4001BMS (quad 2-input), CD4002BMS (dual 4-input), and CD4025BMS (triple 3-input) NOR gates provide the system designer with direct implementation of the NOR function and supplement the existing family of CMOS gates. All inputs and outputs are buffered. The CD4000BMS, CD4001BMS, CD4002BMS, and the CD4025BMS are supplied in these 14-lead outline packages: Braze Seal DIP H4X and H4Q, Frit Seal DIP H1B, and Ceramic Flatpack H3W.