封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | FCGQFN |
| Pkg. Code: | |
| Lead Count (#): | 24 |
| Pkg. Dimensions (mm): | 2.2 x 3 x 0.65 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| RoHS (DA14530-00000FX2) | 英语日文 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 24 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | THAILAND |
| Country of Wafer Fabrication | TAIWAN |
| 2Mbps | Not Supported |
| ADC | 10-bit x 4-ch |
| AoA | Not Supported |
| AoD | Not Supported |
| Application | Low cost BLE connectivity front-end, Data pipes, ATLASlite, HID, IoT, Medical, Proximity tags & trackers |
| Bluetooth® Mesh | Not Supported |
| CPU | M0+ |
| Clock Rate (MHz) | 16 |
| Execute from FLASH | No |
| Extended Advertising | Not Supported |
| External Rails and Load Capacity | None |
| Flash Memory (KB) | 0 |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 12 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 1 |
| Integrated Battery Charger | No |
| Integrated DCDC | N/A |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| MCU/MPU | M0 + |
| MOQ | 4000 |
| Memory Size (OTP) (KB) | 32 |
| Operating Freq (Max) (MHz) | 16 |
| Output Power Range (dBm) | -19.5 - 4 |
| Periodic Advertising | Not Supported |
| Pitch (mm) | 0.4 |
| Pkg. Dimensions (mm) | 2.2 x 3 x 0.65 |
| Pkg. Type | FCGQFN |
| Price (USD) | $0.97559 |
| Proprietary 2G4 protocol | No |
| QSPI Interface (#) | 0 |
| Qty. per Reel (#) | 4000 |
| RAM (KB) | 48KB |
| ROM (KB) | 144 |
| Recommended for new Designs | Yes |
| Rx current (mA) | 5 |
| SPI (#) | 1 |
| Sensitivity (dBm) (dBm) | -94 |
| Supply Voltage Vcc Range | 1.8-3.3 |
| Tx Current (mA) | 9 |
| UART (#) | 2 |
| USB Ports (#) | 0 |
| Wireless Standard | BLE 5.1 Core specification |
有关 DA14530 的资源
描述
SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.
The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal, and a power source. To lower the barrier of entry, SmartBond TINY is also available in an easy-to-use tiny module incorporating all the needed components, making the addition of Bluetooth Low Energy to any application a simple drop-in.
Record low hibernation and active power consumption ensure long operating and shelf life with even the tiniest, disposable batteries. Based on a powerful 32-bit Arm® Cortex®-M0+ with integrated memories and a complete set of analog and digital peripherals, SmartBond TINY is extremely power efficient, delivering a record score of 18300 on the latest EEMBC benchmark for IoT connectivity, IoTMark™. The DA14530 is pin-for-pin compatible with the DA14531 in a 2.2mm x 3.0mm FCGQFN24 package and provides cost savings by operating from an internal LDO, eliminating the cost of a DC/DC inductor. Available in a tiny 2.0mm x 1.7mm package, the DA14531 is half the size of its predecessor or any offering from other leading manufacturers. And, it is complemented by a flexible software development kit (SDK) supporting major compilers such as Keil and GCC out of the box.