封装信息
| Pkg. Type: | QFN |
| Pkg. Code: | |
| Lead Count (#): | 40 |
| Pkg. Dimensions (mm): | 5 x 5 x 0.9 |
| Pitch (mm): | 0.45 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 40 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | Taiwan |
| Price (USD) | 4.30006 |
| 2Mbps | Not Supported |
| ADC | 10-bit x 4-ch |
| AoA | Not Supported |
| AoD | Not Supported |
| Application | Beacons, Proximity tags & trackers, HID, RCU |
| Bluetooth® Mesh | Not Supported |
| Budgetary Price (100u) (USD) | 3.664 |
| Budgetary Price (1ku) (USD) | 2.893 |
| Budgetary Price (1u) (USD) | 5.51 |
| CPU | M0 |
| Clock Rate (MHz) | 16 |
| Execute from FLASH | No |
| Extended Advertising | Not Supported |
| External Rails and Load Capacity | none |
| Flash Memory (KB) | 256 |
| Flexible System Clock | No |
| GATT Caching | Not Supported |
| GPIOs (#) | 24 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 1 |
| Integrated Battery Charger | No |
| Integrated DCDC | Integrated Buck DC-DC converter |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| MCU/MPU | M0 |
| MOQ | 5000 |
| Memory Size (OTP) (KB) | 64 |
| Operating Freq (Max) (MHz) | 16 |
| Output Power Range (dBm) | -20 - 0 |
| Periodic Advertising | Not Supported |
| Pitch (mm) | 0.45 |
| Pkg. Dimensions (mm) | 5 x 5 x 0.9 |
| Pkg. Type | QFN |
| Proprietary 2G4 protocol | No |
| QSPI Interface (#) | 0 |
| Qty. per Reel (#) | 5000 |
| RAM (KB) | 96 |
| ROM (KB) | 128 |
| Recommended for new Designs | Yes |
| Rx current (mA) | 3.7 |
| SPI (#) | 1 |
| Sensitivity (dBm) (dBm) | -93 |
| Supply Voltage Vcc Range | 0.9-3.3 |
| Tx Current (mA) | 3.4 |
| UART (#) | 2 |
| USB Ports (#) | 0 |
| Wireless Standard | BLE 5.0 Core specification |
| 已发布 | Yes |
有关 DA14586 的资源
描述
Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.
As part of the SmartBond family, the DA14586 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V – 3.6V) covers a larger choice of energy sources and gives full design flexibility.
SmartBond™ DA14586 combines the benefits of the lowest power, smallest size and lowest system cost Bluetooth Low Energy SoC with an integrated Flash. Furthermore, the DA14586 is pin-to-pin compatible with the DA14585 thereby offering a unique cost down path from Flash to One-Time-Programmable (OTP) memory.
Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.
Benefits
- Large memory to build complex applications
- Longest battery life
- Low system Bill of Materials (BOM)
Packages
- QFN-40 (5.0mm x 5.0mm x 0.9mm)
- WLCSP-34 (2.4mm x 2.66mm x 0.39mm)