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封装信息

CAD 模型:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BYT142
Lead Count (#):142
Pkg. Dimensions (mm):6.2 x 6.0 x 0.82
Pitch (mm):0.45

环境和出口类别

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14708-00000HZ2)英语日文
ECCN (US)
HTS (US)

产品属性

Pkg. TypeCABGA
Lead Count (#)142
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Pb Free Categorye1 SnAgCu
Temp. Range (°C)-40 to 85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsSupported
ADC10-bit SAR x 4-ch, 11 ENOB, 16Ksps with PGA
AoASupported
AoDSupported
ApplicationRechargeable devices, HMI, Wearables, Smart Home, E-bike, Consoles
Bluetooth® MeshNot Supported
CPUM33F
Clock Rate (MHz)160
Execute from FLASHYes
Extended AdvertisingSupported
External Rails and Load Capacity2 x 1.8V @ 100mA each
Flash Memory (KB)0
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)79
Hardware Crypto EngineYes
I2C (#)4
Integrated Battery ChargerYes, 720mA JEITA compliant charger
Integrated DCDCYes, Low-IQ SIMO Buck & 4.5-5V Boost
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
Length (mm)6.2
MOQ4000
Memory Size (OTP) (KB)4
Operating Freq (Max) (MHz)160
Output Power Range (dBm)-18 - 6
Periodic AdvertisingSupported
Pitch (mm)0.45
Pkg. Dimensions (mm)6.2 x 6.0 x 0.82
Price (USD)$6.35
Proprietary 2G4 protocolYes
QSPI Interface (#)3
Qty. per Carrier (#)0
Qty. per Reel (#)4000
RAM (KB)1536
ROM (KB)32
Recommended for new DesignsYes
Reel Size (in)13
Rx current (mA)1.85
SPI (#)3
Sensitivity (dBm) (dBm)-97
Supply Voltage Vcc Range2.9-5.75
Tape & ReelYes
Thickness (mm)0.82
Tx Current (mA)3
UART (#)3
USB Ports (#)1
Width (mm)6
Wireless StandardBLE 5.2 Core specification + optional features
已发布No

描述

DA14708 延续了瑞萨电子 SmartBond™ 系列的成功经验,采用 160MHz 的 Arm® Cortex®-M33F 作为集成应用处理器、集成了2D GPU、语音活动检测器 (VAD) 和电源管理单元 (PMU)。 凭借其超低功耗无线电收发器提供 +6dBm 的输出功率与 -97dBm 的灵敏度,再加上软件可配置可升级的协议引擎(CMAC),DA14708 能够支持蓝牙™ 低功耗功能以及多种其他 2.4 GHz 协议。 上述独特功能使 DA14708 成为无线 SoC 能够达到如此高集成度的首款产品。