封装信息
| Lead Count (#) | 142 |
| Pkg. Type | VFBGA |
| Pkg. Code | BYT142 |
| Pitch (mm) | 0.45 |
| Pkg. Dimensions (mm) | 6.2 x 6.0 x 0.82 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | 5a992.c |
| HTS (US) | 8542.39.90 |
产品属性
| Pkg. Type | VFBGA |
| Lead Count (#) | 142 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e1 SnAgCu |
| Temp. Range | -40 to +85°C |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | Taiwan |
| Price (USD) | 1ku | 8.74145 |
| 2Mbps | Supported |
| ADC | 10-bit SAR x 4-ch, 11 ENOB, 16Ksps with PGA |
| AoA | Supported |
| AoD | Supported |
| Application | Rechargeable devices, HMI, Wearables, Smart Home, E-bike, Consoles |
| Bluetooth® Mesh | Not Supported |
| CPU | M33F |
| Clock Rate (MHz) | 160 |
| Execute from FLASH | Yes |
| Extended Advertising | Supported |
| External Rails and Load Capacity | 2 x 1.8V @ 100mA each |
| Flash Memory (KB) | 0 |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 79 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 4 |
| Integrated Battery Charger | Yes, 720mA JEITA compliant charger |
| Integrated DCDC | Yes, Low-IQ SIMO Buck & 4.5-5V Boost |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| Length (mm) | 6.2 |
| MOQ | 4000 |
| Memory Size (OTP) (KB) | 4 |
| Operating Freq (Max) (MHz) | 160 |
| Output Power Range (dBm) | -18 - 6 |
| Periodic Advertising | Supported |
| Pitch (mm) | 0.45 |
| Pkg. Dimensions (mm) | 6.2 x 6.0 x 0.82 |
| Proprietary 2G4 protocol | Yes |
| QSPI Interface (#) | 3 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 4000 |
| RAM (KB) | 1536 |
| ROM (KB) | 32 |
| Recommended for new Designs | Yes |
| Reel Size (in) | 13 |
| Rx current (mA) | 1.85 |
| SPI (#) | 3 |
| Sensitivity (dBm) (dBm) | -97 |
| Supply Voltage Vcc Range | 2.9-5.75 |
| Tape & Reel | Yes |
| Thickness (mm) | 0.82 |
| Tx Current (mA) | 3 |
| UART (#) | 3 |
| USB Ports (#) | 1 |
| Width (mm) | 6 |
| Wireless Standard | BLE 5.2 Core specification + optional features |
描述
DA14708 延续了瑞萨电子 SmartBond™ 系列的成功经验，采用 160MHz 的 Arm® Cortex®-M33F 作为集成应用处理器、集成了2D GPU、语音活动检测器 (VAD) 和电源管理单元 (PMU)。 凭借其超低功耗无线电收发器提供 +6dBm 的输出功率与 -97dBm 的灵敏度，再加上软件可配置可升级的协议引擎(CMAC)，DA14708 能够支持蓝牙™ 低功耗功能以及多种其他 2.4 GHz 协议。 上述独特功能使 DA14708 成为无线 SoC 能够达到如此高集成度的首款产品。