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封装信息

Pkg. Type: CABGA
Pkg. Code: BYT142
Lead Count (#): 142
Pkg. Dimensions (mm): 6.2 x 6.0 x 0.82
Pitch (mm): 0.45

环境和出口类别

Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
ECCN (US)
HTS (US)

产品属性

Pkg. Type VFBGA
Lead Count (#) 142
Carrier Type Reel
Moisture Sensitivity Level (MSL) 3
Pb (Lead) Free Yes
Pb Free Category e1 SnAgCu
Temp. Range (°C) -40 to +85°C
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) 8.74145
2Mbps Supported
ADC 10-bit SAR x 4-ch, 11 ENOB, 16Ksps with PGA
AoA Supported
AoD Supported
Application Rechargeable devices, HMI, Wearables, Smart Home, E-bike, Consoles
Bluetooth® Mesh Not Supported
Budgetary Price (100u) (USD) 9.015
Budgetary Price (1ku) (USD) 7.117
Budgetary Price (1u) (USD) 13.556
CPU M33F
Clock Rate (MHz) 160
Execute from FLASH Yes
Extended Advertising Supported
External Rails and Load Capacity 2 x 1.8V @ 100mA each
Flash Memory (KB) 0
Flexible System Clock Yes
GATT Caching Not Supported
GPIOs (#) 79
Hardware Crypto Engine Yes
I2C (#) 4
Integrated Battery Charger Yes, 720mA JEITA compliant charger
Integrated DCDC Yes, Low-IQ SIMO Buck & 4.5-5V Boost
LE Coded PHY (Long Range) Not Supported
LE Data Length Extensions Supported
Length (mm) 6.2
MOQ 4000
Memory Size (OTP) (KB) 4
Operating Freq (Max) (MHz) 160
Output Power Range (dBm) -18 - 6
Periodic Advertising Supported
Pitch (mm) 0.45
Pkg. Dimensions (mm) 6.2 x 6.0 x 0.82
Proprietary 2G4 protocol Yes
QSPI Interface (#) 3
Qty. per Carrier (#) 0
Qty. per Reel (#) 4000
RAM (KB) 1536
ROM (KB) 32
Recommended for new Designs Yes
Reel Size (in) 13
Rx current (mA) 1.85
SPI (#) 3
Sensitivity (dBm) (dBm) -97
Supply Voltage Vcc Range 2.9-5.75
Tape & Reel Yes
Thickness (mm) 0.82
Tx Current (mA) 3
UART (#) 3
USB Ports (#) 1
Width (mm) 6
Wireless Standard BLE 5.2 Core specification + optional features

描述

DA14708 延续了瑞萨电子 SmartBond™ 系列的成功经验,采用 160MHz 的 Arm® Cortex®-M33F 作为集成应用处理器、集成了2D GPU、语音活动检测器 (VAD) 和电源管理单元 (PMU)。 凭借其超低功耗无线电收发器提供 +6dBm 的输出功率与 -97dBm 的灵敏度,再加上软件可配置可升级的协议引擎(CMAC),DA14708 能够支持蓝牙™ 低功耗功能以及多种其他 2.4 GHz 协议。 上述独特功能使 DA14708 成为无线 SoC 能够达到如此高集成度的首款产品。