封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -5 to 95°C |
| Application | 200G/400G/600G Coherent Receivers for QPSK/m-QAM |
| Channels (#) | 2 |
| Data Rate Max (Gbps) | 32 |
| Function | Linear TIA |
| MOQ | 100 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pkg. Type | WAFER |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| 已发布 | No |
有关 GX32223 的资源
描述
The GX32223 is a dual-channel 32Gbps linear Trans-Impedance Amplifier (TIA) for 100G/200G Integrated Coherent Receivers (ICRs).
The GX32223 integrates two TIA signal paths for I and Q channels. The high-performance, low power, and compact design of the GX32223 also enables a small-form factor integrated optical module such as CFP2 and CFP4.