封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Country of Assembly | JAPAN |
| Country of Wafer Fabrication | JAPAN |
| MOQ | 1 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Price (USD) | $17.5252 |
有关 H8S/2113 的资源
描述
The H8S/2113 Group is supported only for customers who have already adopted these products. The RX651, RX210 Groups are recommended for new designs.
