封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | pkg_47 |
| Lead Count (#): | 14 |
| Pkg. Dimensions (mm): | 5 x 4 x 1.1 |
| Pitch (mm): | 0.65 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.33.0001 |
产品属性
| Lead Count (#) | 14 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Country of Assembly | JAPAN, VIETNAM |
| Country of Wafer Fabrication | JAPAN |
| Channels (#) | 4 |
| Function | CMOS Operational Amplifier Output full swing, High slew rate |
| Input Offset Voltage Vio (Max) (mV (±)) | 4 |
| Lead Compliant | Yes |
| Length (mm) | 5 |
| MOQ | 2000 |
| Pkg. Dimensions (mm) | 5 x 4 x 1.1 |
| Pkg. Type | TSSOP |
| Process | CMOS |
| Remarks | Output full swing High slew rate |
| Single Supply Voltage Range (V) | 1.8 - 5.5 |
| Slew Rate (V/µs) | 8 |
| Supply Current Icc/Idd (Max) (mA) | 1.6 |
| Tape & Reel | No |
| Thickness (mm) | 1.1 |
| Width (mm) | 4 |
| field__slew_rate_typical_ | 8 |
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