封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | SOP |
| Pkg. Code: | pkg_9035 |
| Lead Count (#): | 28 |
| Pkg. Dimensions (mm): | 18 x 8 x 2.5 |
| Pitch (mm): |
环境和出口类别
| RoHS (HN58C256AFP10E) | 英语日文 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Carrier Type | Embossed Tape |
| Access Time (ns) | 100 |
| Application | Consumer/Industrial |
| Family Name | Parallel EEPROM |
| Lead Compliant | Yes |
| Lead Count (#) | 28 |
| Length (mm) | 18 |
| MOQ | 1 |
| Memory Capacity (kbit) | 256 |
| Moisture Sensitivity Level (MSL) | 3 |
| Organization (bit) | x 8 |
| Organization (kword) | 32 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 18 x 8 x 2.5 |
| Pkg. Type | SOP |
| Supply Voltage (V) | 4.5 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 2.5 |
| Width (mm) | 8 |
有关 HN58C256AFP10 的资源
描述
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