概览
描述
The MSRZG3E is the Open Standard Module (OSM) compliant System-In-Package based on Renesas RZ/G3E scalable architecture. It provides optimal values for performance, functionality, and power efficiency at the same time. The connector-less OSM form factor supports machine-only production for both SoMs and baseboards and enables highest cost efficiency for the final customer products. The available multimedia codecs, 3D-graphics engine, and optional NPU predestine it for a broad range of multimedia and AI-related applications as well as use in an industrial environment.
图像
特性
- Ready-to-use building blocks (hardware & software) to be integrated on specific baseboards
- Compatible with all OSM size M SoMs, easy exchange in your existing design to use a MSRZG3E.
- Flexible OSMEVK reference baseboard for development and prototyping.
- Profound technical support during development phase, baseboard design services on demand
- Smallest form factor with quad core performance offers extensive CPU functionality OSM size M, 30x45mm2, 476 contacts
- On-demand custom processor-, temperature- and memory-configurations available.
- Custom SoM derivatives, adding special interfaces, or custom board implementation in a different size or geometry offered.
- Temperature range -25°C..+70°C , optional -40°C..+85°C