封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TOLG |
| Pkg. Code: | |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 9.90 x 11.70 x 2.50 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | EAR99 |
| HTS (US) | 8541.29.0095 |
| RoHS (RBA300N10EHPF-5UA02#GB0) | 英语日文 |
| Pb (Lead) Free | Yes |
产品属性
| Pkg. Type | TOLG |
| Standard Pkg. Type | TOLG |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | MALAYSIA |
| Country of Wafer Fabrication | JAPAN |
| Application | Automotive, Industrial Use |
| Automotive Qual. | Yes |
| Channels (#) | 1 |
| Ciss (Typical) (pF) | 13000 |
| Function | Power MOSFETs |
| Gate Level | Standard |
| ID (A) | 340 |
| Id max @ 25°C (A) | 340 |
| Lead Compliant | No |
| Lead Count (#) | 8 |
| Length (mm) | 11.7 |
| MOQ | 1500 |
| Mounting Type | Surface Mount |
| Nch/Pch | Nch |
| Pb (Lead) Free | Yes |
| Pch (W) | 468 |
| Pkg. Dimensions (mm) | 9.90 x 11.70 x 2.50 |
| Price (USD) | $2.31642 |
| Qg typ (nC) | 170 |
| Qualification Level | Automotive |
| RDS (ON) (Max) @10V (mohm) | 1.5 |
| RDS (ON) (Typical) @ 10V / 8V (mohm) | 1.3 |
| Series Name | REXFET-1 |
| Simulation Model Available | Yes |
| Tape & Reel | Yes |
| Target applications | Small Traction, 48V load, OBC, Charging station, LDC, Energy infrastructure, Micro inverter, Power-tool, DC-DC, etc. |
| VDSS (Max) (V) | 100 |
| VGSS (V) | 20 |
| Vgs (off) (Max) (V) | 4 |
| Width (mm) | 9.9 |
有关 RBA300N10EHPF-5UA02 的资源
描述
RBA300N10EHPF-5UA02 N 沟道功率 MOSFET 采用 REXFET-1 分离栅技术，提供 TOLG封装。TOLG封装与TOLL封装引脚布局兼容，并采用海鸥翼式引脚，可实现卓越的板载热循环性能。
瑞萨电子的 REXFET-1 分离栅极技术非常适合需要低 RDS(on) 和重视开关能力的场景，是大功率和高频应用的理想选择。
